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www.rohm.com tsz02201 - 0rfr0g200730 -1-2 ? 2015 rohm co., ltd. all rights reserved. 1/ 18 17.feb.2016 rev.003 tsz22111 ? 14 ? 001 input full swing open drain output low supply current cmos comparators f or automotive bu7233 yf-c g eneral description bu7233yf -c is input full swing , open drain , dual comparator s. it ha s a wide operating temperature range. it feature s low operating supply voltage from 1.8v to 5.5v, l ow supply current and extremely low input bias current. f eatures ? aec- q100 qualified (note 1) ? low operating supply voltage ? low supply current ? input full swing ? open drain output type ? wide o perating t emperature range ? low i nput b ias c urrent (note 1: grade 1) application s ? voltage detection equipment ? limit comparator ? automotive electronics equipment key specification s ? operating supply voltage : single supply 1. 8 v to 5 .5v split supply 0.9v to 2.75v ? supply current: 10ua ( typ ) ? temperature range: - 40c to +125c ? input offset current : 1pa (typ) ? input bias current : 1pa (typ) special characteristic s ? input offset voltage - 40c to + 125c : 15mv (max) package w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm pin configuration (top view) product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays. sop8 + ch 2 - + ch 1 - + 1 2 3 4 8 7 6 5 out2 vss vdd out 1 in1 - in1 + in2+ in2 - datashee t
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 2 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c pin description pin no. pin name function 1 out1 output 2 in1 - inverting input 3 in1 + non - inverting input 4 vss ground/negative power supply 5 in2 + non - inverting input 6 in2 - inverting input 7 out2 output 8 vdd positive power supply block diagram absolute maximum ratings (t a =25c) parameter symbol rating unit supply voltage vdd-vss 7 v power dissipation p d 0.68 (note 2,3) w differential input voltage (note 4) v id vdd - vss v input common - mode voltage range v icm (vss- 0.3) to (v dd +0.3) v input current (note 5) i i 10 ma operating supply voltage v opr 1.8 to 5.5 0.9 to 2.75 v operating temperature t opr - 40 to +125 c storage temperature t stg - 55 to +150 c maximum junction temperature t j max 150 c (note 2 ) to use at temperature above t a =25 c reduce 5.5mw/ c . (note 3 ) mounted on a n fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 4 ) the voltage difference between inverting input and non - inverting input is the differential input voltage. the input pin voltage is set to more than v ss. (note 5 ) an excessive input current will flo w when input voltages of more than v dd +0.6v or less than v ss - 0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the abso lute maximum ratings. vbias vbias vdd in+ in - vss out output control figure 1 . block diagram (one channel only)
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 3 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c electrical characteristics ( unless otherwise specified vdd=3v, vss=0v, t a =25c ) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 6 , 7 ) v io 25c - 1 14 mv - full r ange - - 15 input offset current (note 6 ) i io 25c - 1 - pa - input bias current (note 6 , 7 ) i b 25c - 1 300 pa - full r ange - - 6 000 supply current (note 7 ) i dd 25c - 10 25 a rl = all comparators full r ange - - 50 maximum output voltage(high) (note 7 ) v oh 25c v dd - 0. 05 - - v rl =10k , v rl =3v full r ange v dd - 0.1 - - maximum output voltage(low) (note 7 ) v ol 25c - - v ss +0. 05 v rl=10k full r ange - - v ss +0.1 large signal voltage gain (note 9 ) a v 25c - 100 - db rl=10k input common - mode voltage range v icm 25c 0 - 3 v - common - mode rejection ratio cmrr 25c - 80 - db - power supply rejection ratio psrr 25c - 80 - db - output sink current (note 7,8 ) i sink 25c 3 7 - ma out = vss +0.4v full r ange 1 - - output fall time t f 25c - 20 - ns r l =10k vrl =3v c l =15pf in - =1.5v 100mv o verdrive propagation delay time l to h (note 7 ,9 ) t plh 25c - 1.8 - s full r ange - - 5 propagation delay time h to l (note 7 ) t phl 25c - 0.6 - s full r ange - - 3 (note 6 ) absolute value (note 7 ) full r ange : t a = - 40c to + 1 2 5 c (note 8 ) consider the power dissipation of the ic under high temperature environment when selecting the output current value. there may be a case where the output current value is reduced due to the rise in ic temperature caused by the heat generated inside the ic. (note 9 ) propagation delay time l to h and large signal voltage gain is affect ed by the pull - up resistance value.
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 4 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c description of electrical characteristics described below are descriptions of the relevant electrical terms used in this datasheet . items and symbols used are also shown. note that item name and symbol and their meaning may differ from those on another manufacturer?s document or general document. 1. absolute m aximum r atings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 s upply v oltage (vdd/v ss) indicates the maximum voltage that can be applied between the vdd pin and vss pin without deterioration or destruction of characteristics of internal circuit. 1.2 differential i nput v oltage (v id ) indicates the maximum voltage that can be applied between non - inverting and inverting pin s without damaging the ic. 1.3 input c ommon - mode v oltage r ange (v icm ) indicates the maximum voltage that can be applied to the non - inverting and inverting pin s without deterioration or destruction of electrical characteristics. input common - mode voltage range of the maximum ratings does not assure normal operation of ic. for normal operation, use the ic within the input common - mode voltage range characteristics. 1.4 power d issipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient temperature 25 c (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temper ature) and the thermal resistance of the package. 2. electrical c haracteristics 2.1 input o ffset v oltage (v io ) indicates the voltage difference between non - inverting pin and inverting pin s. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2.2 input o ffset c urrent (i io ) indicates the difference of input bias current between the non - inverting and inverting pin s. 2.3 input b ias c urrent (i b ) indicates the current that flows into or o ut of the input pin . it is defined by the average of input bias currents at the non- inverting and inverting pin s. 2.4 supply c urrent (i dd ) indicates the current that flows within the ic under specified no - load conditions. 2.5 maximum o utput v oltage (high) / maximum o utput v oltage (low) (v oh /v ol ) indicates the voltage range of the output under specified load condition. it is typically divided into maximum o utput v oltage high and low. maximum o utput v oltage high indicates the upper limit of output voltage. maximum o utput v oltage l ow indicates the lower limit. 2.6 large s ignal v oltage g ain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non - inverting pin and inverting pin . it is normally the amplifying rate (gain) with reference to dc voltage. av = (output v oltage) / ( differential i nput v oltage ) 2.7 input c ommon - mode v oltage r ange (v icm ) indicates the input voltage range where ic normally operates. 2.8 common - mode r ejection r atio (cmrr) indicates the ratio o f fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of i nput c ommon - mode voltage)/(input offset fluctuation) 2.9 power s upply r ejection r atio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply voltage)/(input offset fluctuation) 2.10 o utput s ink c urrent ( i sink ) the maximum current that can be output from th e ic under specific output conditions. t he output sink current indicates the current flowing into the ic. 2.11 o utput fall time (t f ) indicates the time required for an output voltage step to change from 90% to 10% of its final value. 2.12 propagation delay time l to h / propagation delay time h to l (t plh / t phl ) indicates the time to reach 50% of the output voltage after the step voltage is applied at the input pin.
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 5 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c typical performance curves (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 1 2 3 4 5 6 1 2 3 4 5 6 maximum output voltage (high) [v] supply voltage [v] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 supply current [a] ambient temperature [ c] 0 10 20 30 40 1 2 3 4 5 6 supply current [a] supply voltage [v] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 power dissipation [w] ambient temperature [ c] figure 2 . power dissipation vs ambient temperature ( derating c urve ) figure 3 . supply current vs supply voltage figure 4 . supply current vs ambient temperature - 40c 25c 125c 1.8v 5.5v 3.0v figure 5 . maximum output voltage ( high ) vs supply voltage ( rl=10k, vrl =v dd ) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 6 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c typical performance curves - c ontinued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 maximum output voltage (low) [mv] ambient temperature [ c] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 maximum output voltage (high) [v] ambient temperature [ c] 0 5 10 15 20 25 30 1 2 3 4 5 6 maximum output voltage (low) [mv] supply voltage [v] figure 7 . maximum output voltage ( low ) vs supply voltage ( rl=10k, vrl =v dd ) figure 6 . maximum output voltage ( high ) vs ambient temperature ( rl=10k, vrl=v dd ) figure 8 . maximum output voltage ( low ) vs ambient temperature (r l=10k , vrl =v dd ) 1.8v 5.5v 3.0v - 40c 25c 125c 1.8v 5.5v 3.0v 0 2 4 6 8 10 0.0 0.4 0.8 1.2 1.6 2.0 output sink current [ma] output voltage [v] figure 9 . output s ink current vs output voltage (v dd = 1.8 v) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 7 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c figure 12 . output sink current vs ambient temperature ( out= v ss + 0.4v) typical performance curves - c ontinued (*)the above characteristics are measurements of typical sample, they are not guaranteed. -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 1 2 3 4 5 6 input offset voltage [mv] supply voltage [v] 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 output sink current [ma] ambient temperature [ c] 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output sink current [ma] output voltage [v] figure 10 . output s ink current vs output voltage (v dd =3v) - 40c 25c 125c 0 20 40 60 80 0 1 2 3 4 5 6 output sink current [ma] output voltage [v] figure 11 . output s ink current vs output voltage (v dd = 5.5 v) - 40c 25c 125c 1.8v 5.5v 3.0v figure 13 . input offset voltage vs supply voltage (v icm =v dd , e k = - v dd /2 ) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 8 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c typical performance curves - c ontinued (*)the above characteristics are measurements of typical sample, they are not guaranteed. -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 input offset voltage [mv] ambient temperature [ c] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 input offset voltage [mv] input voltage [v] figure 14 . input offset voltage vs ambient temperature (v icm =v dd, e k = -vdd/2 ) 5.5v 3.0v 1.8v figure 16 . input offset voltage vs input voltage ( v dd =3v ) - 40c 25c 125c -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 input offset voltage [mv] input voltage [v] figure 15. input offset voltage vs input voltage ( v dd = 1.8 v ) - 40c 25c 125c -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 5 6 7 input offset voltage [mv] input voltage [v] figure 17 . input offset voltage vs input voltage ( v dd = 5.5 v ) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 9 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c typical performance curves - c ontinued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 large signal voltage gain [db] ambient temperature [ c] 60 80 100 120 140 160 1 2 3 4 5 6 large signal voltage gain [db] supply voltage [v] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 common - mode rejection ratio [db] ambient temperature [ c] 0 20 40 60 80 100 120 1 2 3 4 5 6 common - mode rejection ratio [db] supply voltage [v] figure 19 . large signal voltage gain vs ambient temperature 5.5v 1.8v 3.0v figure 18 . large signal voltage gain vs supply voltage - 40c 25c 125c figure 20. common - mode rejection ratio vs supply voltage - 40c 25c 125c figure 21 . common - mode rejection ratio vs ambient temperature 5.5v 1.8v 3.0v
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 10/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c typical performance curves - c ontinued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 propagation delay time h to l [ s] ambient temperature [ c] 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 propagation delay time l to h [ s] ambient temperature [ c] figure 22 . power supply rejection ratio vs ambient temperature figure 24 . propagation delay time h to l vs ambient temperature (r l =10 k , vrl =3v , c l = 1 5 p f, in - =1.5v, 100mv o verdrive ) 5.5v 3.0v 1.8v figure 23 . propagation delay time l to h vs ambient temperature (r l =10 k , vrl =3v , c l = 1 5pf , in - =1.5v, 100mv o verdrive ) 5.5v 3.0v 1.8v 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 power supply rejection ratio [db] ambient temperature [ c]
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 11 / 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c application information null m ethod c ondition s for test circuit 1 vdd, vss, e k , v icm , v rl unit :v parameter v f sw1 sw2 sw3 vdd vss e k v icm v rl calculation input o ffset v oltage v f1 on on on 3 0 - 0.1 0.25 3 1 large s ignal v oltage g ain v f2 on on on 3 0 - 0.3 0.25 3 2 v f3 - 2.7 common - mode r ejection r atio (input c ommon - mode v oltage r ange) v f4 on on on 3 0 - 0.1 0.25 3 3 v f5 3 power s upply r ejec t ion r atio v f6 on on on 1.8 0 - 0.1 0 1.8 4 v f 7 5.5 5.5 - calculation - 1. input offset voltage (v io ) 2. large signal voltage gain (a v ) 3. common - m ode rejection ratio (cmrr) 4. power s upply r ejection r atio (psrr) figure 25 . test circuit 1 (one channel only) |v f5 - v f4 | cmrr = 20log ? v icm (1+r f /r s ) [db] av = 20log |v f3 - v f2 | ? e k (1+r f /r s ) [db] |v f7 - v f6 | ? v dd (1+ r f /r s ) [db] v io = 1 + r f /r s [v] |v f1 | psrr = 20log ) vdd v icm r s r s r f n r i 0 r i 0 0. 47 ) 0. 47 ) sw1 sw2 n sw3 r l v rl e k n n v f ) 15v - 15v vss v out v null dut 1000pf
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 12/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c output wave t plh t f input wave input voltage input wave input voltage t output voltage 0v 3v 1.5v 50% 50% 10% 90% t phl output voltage 1.4v 1.6v t 1.5v 100mv overdrive 1.4v 1.6v t 100mv overdrive output wave t 0v 3v 1.5v 1. 5 v application information - continued switch condition s for test c ircuit 2 parameter sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 supply c urrent off on on off off off off off m aximum o utput v oltage (r l =10k ) off on on on off off on off o utput sink c urrent off on on off off on off off propagation delay time on off o n on on off off on figure 26 . test circuit 2 ( one channel only) figure 27 . propagation delay time input and output wave v in sw1 sw2 sw5 sw6 sw7 sw4 sw3 c l sw8 r l vss vdd v out v in+ v in - v rl
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 13/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing pr ocess, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 2 8 (a) shows the model of the thermal resistance of the package. the equation below shows how to compute for the t hermal resistance ( ja ), give n the ambient temperature ( t a ), maximum junction temperature ( t jmax ), and power dissipation (p d ). ja = (t jmax -t a ) / p d c/w the d erating curve in figure 2 8 (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may als o vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 2 8 (c) shows the derating curve for bu7233yf -c . (note 10) unit 5.5 mw/ c when using the unit above t a =25c, subtract the value above per celsius degree. power dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area less than 3%) is mounted. 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 power dissipation [w] ambient temperature [ c] (c) bu 7233yf - c ambient t emperature t a [ c ] chip surface temperature t j [ q c ] (a) thermal r esistance ja = ( t jmax - t a ) / p d q c /w (b) derating c urve ambient temperature t a [ c ] power dissipation of lsi [w] p d max ja2 < ja1 0 50 75 100 125 150 25 p1 p2 ja2 ja 1 t jmax power d issipation of ic figure 28 . thermal resistance and derating curve (note 10 )
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 14/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, co nnect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, e ven during transient condition. 4. g round w iring p attern when using both small - signal and large- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. t hermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capa citance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off comple tely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors e nsure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pin s input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is eno ugh to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. u nless otherwise specified, unused input pin s should be connected to the power supply or ground line. 12. regard ing the i nput p in of the ic in the construction of this ic, p - n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, con ditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. ev en if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic .
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 15/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c operational notes ? continued 13. unused c ircuits when there are unused comparators, it is recommended that they are connected as in figure 2 9 , setting the non - inverting input pin to the vdd, inverting input pin to the vss. 14. i nput voltage applying vss- 0.3v to vdd +0.3v to the input pin is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally on ly when the input voltage is within the common mode input voltage range of the electric characteristics. 15. power s upply( single / d ual ) the voltage comparator operate s when the voltage supplied is between vdd and vss. therefore, the single supply voltage compa rator can be used as dual supply voltage comparator as well. 16. output c apacitor if a large capacitor is connected between the output pin and vss pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the v dd pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0. 1f between output pin and vss pin . 17. latch u p be careful of input voltage that exceed the v dd and v ss . when cmos device have sometimes occur latch up a nd protect the ic from abnormaly noise. 18. open drain output please connect and use a pull - up resistor to the output since this ic has an open- drain output. 19. supply voltage start - up when start up the supply voltage that the ic has output the applied vdd pin voltage until voltage reaches around 1v. this function is not depending on input condition. this voltage has a possibility of the malfunction. please give the special consideration for startup order of supply voltage. 20. ceramic capacitor when using a cera mic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. v ss v dd figure 29 . example of application circuit for unused comparator
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 16/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c physical dimensions, tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112 - 5001 - 1 (max 5.35 (include.burr))
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 17/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c ordering information b u 7 2 3 3 y f - c e2 part number package product rank bu7233yf f : s op8 c: automotive packaging and forming specification e2: embossed tape and reel line - up t opr channel s package orderable part number - 40c to + 125c 2ch sop8 reel of 2500 bu7233yf - ce2 marking diagram part number marking package orderable part number 7233y sop8 bu7233y f -c e2 land pattern data all dimensions in mm package land pitch e land space mie land length R? 2 land width b2 sop8 1.27 4.60 1.10 0.76 sop8 (top view) part number marking lot number 1pin mark b 2 mie e ?2 sop8
datasheet www.rohm.com tsz02201 - 0rfr0g200730 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 18/ 18 17.feb.2016 rev.003 tsz22111 ? 15 ? 001 bu7233yf - c revision history date revision changes 2 5 . feb .2015 001 new release 17.mar.2015 002 t he correction of graph data and test circuit 17 .feb.2016 003 applications : change, note : addition(note 9 ) , typical performance curves : change( temperature - axis range ), marking diagrams : change( table ), application information : correction ( null method /switch conditions )
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu7233yf-c package sop8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bu7233yf-c - web page distribution inventory

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